OmniVision's OG02B1B (monochrome) and OG02B10 color) are global shutter image sensors designed to cost-effectively enable a wide range of consumer ano ndustrial machine vision applications such as AR/VR headsets and accessories, industrial automation, robotics, agricultural drones and 3D modeling. These sensors provide designers with best-in-class resolution and the option for full-color imaging, and both have a 15 degree chief ray angle (CRA) to support wide field-of-view lens designs. This combination of color imaging and CRA is excellent for applications such as agricultural drones that must capture high-resolution color images for crop and field monitoring.

Available in a 1/2.9 inch optical format, the OG02B1B and OG02B10 capture 2 megapixel or 1600 x 1300 resolution images and video at 60 frames per second (fps) using advanced 3 x 3 micron OmniPixel 3-GS pixel technology. This global shutter technology eliminates motion artifacts and blurring, and dramatically improves low-light sensitivity. Additionally, both sensors' excellent near infrared (NIR) sensitivity at 850 nm and 940 nm helps reduce device power consumption to extend battery life.

 

The OG02B1B image sensor is a low voltage, high performance, 1/2.9-inch, monochrome, CMOS, image sensor that provides the functionality of a 2 megapixel (1600x1300) camera using OmniPixel 3-GS technology. The OG02B1B provides full-frame, sub-sampled, cropped, or windowed 8/10-bit images via the control of the Serial Camera Control Bus (SCCB) interface.

The OG02B1B has an image array capable of operating at up to 60 frames per second (fps) in 10-bit, 2 megapixel resolution with complete user control over image quality, formatting, and output data transfer.

In addition, OmniVision image sensors use proprietary sensor technology to improve image quality by reducing or eliminating common lighting/electrical sources of image contamination, such as fixed pattern noise, smearing, etc., to produce a clean, fully stable image.

For customized information purposes, the OG02B1B includes 128 bytes of one-time programmable (OTP) memory. The OG02B1B has a one/two-lane MIPI interface and parallel DVP interface

※ augmented and virtual reality

※ drones

※ 3D imaging

※ machine vision

※ industrial bar code scanning

※ industrial automation

 

※ 3 μm x 3 μm pixel with OmniPixel 3-GS technology

※ Automatic black level calibration (ABLC)

※ Programmable controls for frame rate, mirror and flip, cropping and windowing

※ Support output formats: 8/10-bit RAW

※ Fast mode switching

※ supports 2x2 monochrome binning

※ Two-lane MIPI serial output interface

※ DVP parallel output interface

※ Supports horizontal and vertical 2:1 monochrome subsampling

※ Support for image sizes: 1600 x 1300, 1280 x 720, 640 x 480

※ embedded 128 bytes of one-time programmable (OTP) memory

※ Two on-chip phase lock loops (PLLs)

※ LED PWM

※ Temperature sensor

※ Built-in strobe control

※ active array size: 1600 x 1300

※ power supply:

     analog: 2.8V (nominal)

     core: 1.2V (nominal)

     I/O: 1.8V (nominal)

※ power requirements:

     active: 190 mW

     XSHUTDOWN: <25 μA

※ temperature range:

     operating: -30°C to 85°C junction temperature (see table 8-2)

     stable image: 0°C to 50°C junction temperature (see table 8-2)

※ output interface: 2-lane MIPI serial output and DVP parallel output

※ output formats: 10-bit RAW

※ lens size: 1/2.9"

※ input clock frequency: 6~27 MHz

※ lens chief ray angle: 15° linear

※ max S/N ratio: 37.4 dB

※ dynamic range: 68 dB

※ maximum image transfer rate: 1600 x 1300: 60 fps

※ sensitivity:

     114Ke-/(μW.cm-2.sec) @ 850 nm

     54Ke-/(μW.cm-2.sec) @ 940 nm

※ minimum exposure time: 1 row period

※ maximum exposure time: frame length - 12 row periods, where frame length is set by registers {0x380E, 0x380F}

※ pixel size: 3 μm x 3 μm

※ image area: 4857.696 μm x 3955.896 μm

※ package dimensions: 7219 μm x 6157 μm (see section 9 for details)

 

※  3um x 3 um pixelwith OmniPixel 3-GS technology

※  Automatic black level calibration (ABLC)

※  Programmable controls for:

     - frame rate

     - mirror and flip

     - cropping

     - windowing

※  Support output formats: 8/10-bit RAW

※  Fast mode switching

※  Supports 2x2 monochrome binning

※  Two-lane MIPI serial output interface

※  DVP parallel output interface

※  Supports horizontal and vertical 2:1 monochrome subsampling

※  Support for image sizes: 

     -1600 x 1300

     -1280 x 720

     -640x 480

※  Embedded 128 bytes of one-time programmable (OTP) memory

※  Two on-chip phase lock loops (PLLs)

※  LED PWM

※  Temperature sensor

※  Built-in strobe control

 

※  OG02B1B-GA4A(B&W, chip probinp, 200 um backgrinding, reconstructed wafer with good die)

※  OG02B1B-A75A (b&w, lead-free) 75-pin CSP

 

※  Active array size: 1600x 1300

※  Maximum image transfer rate:- 1600 x 1300:60 fps. 

※  Power supply:- analog: 2.8v (nominal) -core- 1.2V (nominal)-1/0:1.8V (nominal)

※  Power requirements:- active: 190 mW- XSHUT DOWN: <25 μA

※  Interface:2-lane MIPI serial autput and DVP parallel output

※  Temperature range:

     -operating:-30°C to +85°C  junction temperature

     -stable image: 0°C to -50°C junction temperature

※  Output formats: 10-bit RAW

※  Lens size: 1/2.9"

※  Lens chief ray angle: 15° linear

※  Pixel size: 3μm x 3μm

※  Image area ：4857.696μm  x 3955.896μm

※  Pack Weight：275g

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